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  351 motorola sensor device data www.motorola.com/semiconductors  "  "       ! motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a submodule component or a disposable unit. the unique concept of the chip pak allows great flexibility in system design while allowing an economic solution for the designer. this new chip carrier package uses motorola's unique sensor die with its piezoresistive technology, along with the added feature of onchip, thinfilm temperature compensation and calibration. note: motorola is also offering the chip pak package in applicationspecific configurations, which will have an aspxo prefix, followed by a fourdigit number, unique to the specific customer. features ? low cost ? integrated temperature compensation and calibration ? ratiometric to supply voltage ? polysulfone case material (medical, class v approved) ? provided in easytouse tape and reel application examples ? medical diagnostics ? infusion pumps ? blood pressure monitors ? pressure catheter applications ? patient monitoring note: the die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). front side die and wire protection must be provided in the customer's housing. use caution when handling the devices during all processes. motorola's MPX2300DT1/mpx2301dt1 pressure sen- sors have been designed for medical usage by combining the performance of motorola's shear stress pressure sensor design and the use of biomedically approved materials. materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. it can be sterilized using ethylene oxide. the portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. the rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, usp. a silicone dielectric gel covers the silicon piezoresistive sensing element. the gel is a nontoxic, nonallergenic elasto- mer system which meets all usp xx biological testing class v requirements. the properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. the gel provides electrical isolation sufficient to withstand defibrillation testing, as speci- fied in the proposed association for the advancement of medical instrumentation (aami) standard for blood pressure transducers. a biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the per- formance of the sensor. the mpx2301dt1 is a reduced gel option. preferred devices are motorola recommended choices for future use and best overall value.  
 semiconductor technical data   pressure sensors 0 to 300 mmhg (0 to 40 kpa) pin number mpx2300/1dt1 case 423a 1 2 v s s+ 3 4 s gnd motorola preferred device chip pak package rev 5

  
  352 motorola sensor device data www.motorola.com/semiconductors maximum ratings (note) rating symbol value unit maximum pressure (backside) p max 125 psi storage temperature t stg 25 to + 85 c operating temperature t a + 15 to + 40 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 6 vdc, t a = 25 c unless otherwise noted) characteristics symbol min typ max unit pressure range p op 0 e 300 mmhg supply voltage (7) v s e 6.0 10 vdc supply current i o e 1.0 e madc zero pressure offset v off 0.75 e 0.75 mv sensitivity e 4.95 5.0 5.05 m v/v/mmhg full scale span (1) v fss 2.976 3.006 3.036 mv linearity + hysteresis (2) e 1.5 e 1.5 %v fss accuracy (9) v s = 6 v, p = 101 to 200 mmhg e 1.5 e 1.5 % accuracy (9) v s = 6 v, p = 201 to 300 mmhg e 3.0 e 3.0 % temperature effect on sensitivity tcs 0.1 e + 0.1 %/ c temperature effect on full scale span (3) tcv fss 0.1 e + 0.1 %/ c temperature effect on offset (4) tcv off 9.0 e + 9.0 m v/ c input impedance z in 1800 e 4500 w output impedance z out 270 e 330 w r cal (150 k w ) (8) r cal 97 100 103 mmhg response time (5) (10% to 90%) t r e 1.0 e ms temperature error band e 0 e 85 c stability (6) e e 0.5 e %v fss notes: 1. measured at 6.0 vdc excitation for 100 mmhg pressure differential. v fss and fss are like terms representing the algebraic difference between full scale output and zero pressure offset. 2. maximum deviation from endpoint straight line fit at 0 and 200 mmhg. 3. slope of endpoint straight line fit to full scale span at 15 c and + 40 c relative to + 25 c. 4. slope of endpoint straight line fit to zero pressure offset at 15 c and + 40 c relative to + 25 c. 5. for a 0 to 300 mmhg pressure step change. 6. stability is defined as the maximum difference in output at any pressure within p op and temperature within +10 c to + 85 c after: a. 1000 temperature cycles, 40 c to +125 c. b. 1.5 million pressure cycles, 0 to 300 mmhg. 7. recommended voltage supply: 6 v 0.2 v, regulated. sensor output is ratiometric to the voltage supply. supply voltages above +10 v may induce additional error due to device selfheating. 8. offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to v s and s+ output. 9. accuracy is calculated using the following equation: error p = {[v p offset)/(sens nom *v ex )]p}/p where: v p = actual output voltage at pressure p in microvolts ( m v) offset = voltage output at p = 0mmhg in microvolts ( m v) sens nom = nominal sensitivity = 5.01 m v/v/mmhg v ex = excitation voltage p = pressure applied to the device

  
  353 motorola sensor device data www.motorola.com/semiconductors ordering information the MPX2300DT1/mpx2301dt1 silicon pressure sensors are available in tape and reel packaging. device type/order no. case no. device description marking MPX2300DT1 423a chip pak, full gel date code, lot id mpx2301dt1 423a chip pak, 1/3 gel date code, lot id packaging information reel size tape width quantity tape and reel 330 mm 24 mm 1000 pc/reel


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